ES Components978-422-7641

www.escomponents.com

What TheHeck Is

Bare Die?A technical explanation of Bare Die, itsbenefits, and how it must be handled to

ensure long-term reliability. It answers thequestion: What is Bare Die?

Buyers &EngineersFind Out

Now!

Use Bare Die Where?Aerospace

MilitaryAvionics

Medical ImplantAutomotive

High-end Industrial

Smaller Size & WeightOperating Temperature Size

RuggednessLighter Weight

ReliabilityElectrical Performance

Hermetically Sealing

Build A HybridMicrocircuit

The ManufacturerProduces A Wafer

That YieldsThe Bare Die

ManufacturerShips

To ADistributor

TheDistributor Will

FindA Distributor

CanTrust

YouInspect

The Bare Die

A SampleYou Request

Build The BreadboardRun Characterization Data

Create A Hybrid Or Multi-Chip Module

And...

SendBOM

Bill Of MaterialTo

Distributor DistributorReviews Specifications

&Asks Questions

Questions

You

Is The Device Suitable For Wire Bonding?Are You Soldering To The Top Contact Or Wire Bonding?

How Are You Planning To Attach The Die?How Will You Want This Bare Die Packaged For Delivery?

By Answering These

Assembly OptionsFor HybridPackaging

Die Bonding

Die BondingMethods

EutecticSolder

AdhesiveGlass or Silver-Glass

EutecticDie Bonding

Good Thermal ConductivityElectrically Conductive

Good Fatigue/Creep ResistanceLow Contamination

AdhesiveDie Bonding

Ease Of AutomationLow Curing Temperatures

Reduced Die StressesLow Cost

Wide Range Of Die SizesSpecial Plated Surfaces Are Not Required

Rework Is Possible

Glass Die Bonding

Relatively Insensitive To MetallizationLow Void Content

Good Thermal & Electrical Conductivity Limited Stress Relaxation

Low ContaminationHigh Process/Operating Temperature

Resistance

How Bare Die isHandled to Ensure

Long-term Reliability

Bare Die Is Delivered InDifferent Forms

HandlingConsideration To...

Ensure Long-Term Reliability

Electric Fields & Over VoltagesMechanical Damage

Surface Contamination

HandlingConsideration For...

Electric Fields & Over Voltages

Handle Bare Die In AnElectrostatic Environment

HandlingConsideration For...

MechanicalDamage

Bare Die Damaged By StaticElectricity

HandlingConsideration For...

SurfaceContamination

Interconnections & Molding StepsSensitive To Microscopic &Macroscopic Contaminated

Surfaces

Workplace RequirementsClean RoomElectrical GroundingSpecial Working BehaviorBare Die HandlingToolsPackagingTransportationStorageShelf-Life

Clean Room Requirements

Environment Of At Least Class 1000 (ISO 6) Or Better

The External and InternalAir For The Clean RoomIs Filtered Through HighEfficient Filter Systems

All Equipment Used In AClean Room Has To Be

Designed To AvoidEmissions

ElectricalGrounding

Requirements

Devices Which Could Be InContact With The Die MustBe On The Same Electrical

PotentialGrounded Workbench Surface

Conductive CarpetsGrounded Chairs

Low Impedance Place MatsGrounding Wrist Straps

ESD Safe Shoes, Coats, Gloves

Dedicated Equipment

Clean Room Areas Limited To Necessary Persons

Eating, Drinking, and Smoking Not Allowed

Nervous mannerisms such as scratching the head,rubbing hands or parts of the body, are to beavoided.

All material can only be moved from one cleanroom to another in the same or lower clean roomclass, but never in the other direction.

Special Working Behavior

Clean Room Areas Limited To Necessary Persons

Eating, Drinking, and Smoking Not Allowed

Nervous mannerisms such as scratching the head,rubbing hands or parts of the body, are to beavoided.

All material can only be moved from one cleanroom to another in the same or lower clean roomclass, but never in the other direction.

Bare DieHandling

Never Handle By Bare FingersActive Side Never TouchedMechanical Pressure Limited

Store & Transport In Protective Bags, Tubes Or BoxesWork Only Safe Clean Room Environments

Tools Used ToSafely Move Die

Without Damage

PackagingDie Stored In An Aluminum (Anti-Static)

Vacuum Bag Injected With Nitrogen(Inert Gas)

Protect Against Extreme Temperatures, Humidity, DirectSunlight, and Mechanical ForcesTemperature Has To Be Between 8 °C to 60 °CConditioned Cargo Rooms Are Mandatory For Air TransportTemperature Has To Be Between 8 °C to 45 °C

StorageTemperature Between 8-45 Degrees CentigradeHumidity Between 25% - 75%, No CondensationNo Exposure To Direct Sunlight

Shelf LifeBare Die In Tray - 3 yearsWafer On FFC - 0.5 yearsUnsawn Wafer - 3 years