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DDi ATE / BIBTechnology Overview

June 25, 2009

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Notice

Notification of Proprietary Information: This document contains proprietary information of DDi Corp. and its receipt or possession does not convey any rights to reproduce or disclose its contents, or to manufacture, use, or sell anything it may describe. Reproduction, dissemination, disclosure, or use, in whole or in part, without specific written authorization of DDi Corp. is strictly forbidden. All data contained within this document are subject to this restriction.

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ATE/BIB Market Opportunities

• DDi has been focused on the ATE and BIB market segment for some time. We have been working with our customers to understand their demand and technology requirements in this market sector.

• This market is important to DDi as we are always seeking to expand our product offerings and leverage existing customer relationships

• We recently announced that we have extended our capabilities andcapacity with the acquisition of key capital and human assets tosupport the high end ATE market

• This market requires specialized equipment and processing expertise in the following areas:– Material movement and layer to layer registration– Lamination process controls– High aspect ratio drilling and positional accuracy– High aspect ratio electroless and electrolytic copper plating– Very tight hole to copper tolerances– Understanding of customer’s design rules and requirements

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Semiconductor Manufacturers

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1. Probe Cards

3. ATE Boards

2. THB Boards

5. System Boards

4. Burn-in Boards

Multiple Levels of Semiconductor Testing

Wafer Level Testing

Package Level Testing

Package Level Testing

Package Level TestingNew Market Opportunities

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Probe Card PCB’s

Semiconductor Wafer Level Testing

12” Silicon Wafer

Electroglas Wafer Prober

Prober Manufacturers:

Aehr Test Electroglas

MicroTec Tokyo Electron

Close-Up

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THB - HAST PCB’s

THB - Temperature, Humidity, Bias testing is a reliability test designed to accelerate metal corrosion, particularly that of the metallization on the die surface of the device.

HAST - Highly Accelerated Temperature/Humidity Stress Test. It was developed as a shorter alternative to THB testing.

Trio Tech 6000XPressurized Humidity Test Systems

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ATE PCB’s

1. ATE (Automatic Test Equipment) Boards

2. DUT (Device Under Test) Boards

3. Performance Boards

4. Load Boards

Test Equipment Boards have a number of names:

Teradyne Tester

Packaged Semiconductor Testing

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Burn In Board (BIB) PCB’s

Packaged IC Burn-in

Three types of Burn-in

1. Static Burn-in

2. Dynamic Burn-in

3. Test & Burn-in

Micro Control Oven

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Introducing New Team Members

• John Papagni, Director ATE/BIB Technology, brings 30 years of experience to DDi. Prior to joining DDi John was President and CEO of Technitron, a leading producer of PCB’s for the ATE/BIB market

• Armando Ceballos, Production Manager, will be responsible for production training and manufacturing coordination of the ATE/BIB product line, Armando brings 25+ years of experience to DDi.

• Keith Lal, Senior Drill Technician, will be responsible for driving drill technology and critical processing steps into the day to day operations at DDi. Keith has 20+ years experience in high aspect ratio precision drill processing of ATE/BIB PCB’s

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DDi ATE Market Support

• Dual site approach – Milpitas with additional equipment and engineering support– Anaheim by leveraging current technology and expertise– Share synergies site to site

• In Milpitas…DDi has acquired, installed, and certified the following specialized equipment assets:– Lamination tooling for oversized panels– PLC controlled lamination press for tight tolerance heat rise

parameters– High aspect ratio Electroless copper plating line – Large Format photo printer for oversized panels– Solder mask developer with high pressure rinse– High speed multi-spindle drill machines for high aspect ratio

drilling• In Anaheim…DDi has transitioned flip drill technology and high aspect

ratio pulse plating capability for this product set

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Equipment – Lam Press

Lauffer “PLC Controlled” Hot Oil Press

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Equipment – Pluritec & Router

Pluritec Inspecta X-RayDrill Position Optimizer

PDA Router

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Equipment – Hitachi Drill Machines

Five Additional Hitachi’s(Eight Total)

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Equipment – Exposure & Planarizer

Large Format photo printer

MASS Planarizer

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Equipment – Electroless

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Equipment – SM Developer

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Equipment – Testers

Three Additional Flying Probe

Electrical Testers

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• ‘DDi Standard'DDi’s current everyday capability with no premium.

•• ‘‘DDi Advanced'DDi Advanced' = DDi’s current everyday capability with a small premium

• ‘DDi Engineering' = product DDi has experience with and can build on request with a significant premium

ATE Design Guidelines

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ATE Design Guidelines

> 0.250”

Standard Advanced Engineering

Layer Count Up to 30 layers 32 to 40 42 to 60

External Trace 0.003" 0.0025" 0.002"External Space 0.003" 0.0025" 0.002"Internal Trace 0.003" 0.0025" 0.002"Internal Space 0.003" 0.0025" 0.002"

Drill Diameter 0.006" 0.006“ & 0.005” 0.004"Pad Diameter 0.010" 0.008" 0.005"

0.004" drill 32:10.006" drill 20:1 32:10.008" drill 25:1 32:1

0.125" 0.200"0.187" 0.250"

Trace & Space

PCB Thickness

Drilled Via Size

Aspect Ratio

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ATE Design Guidelines

Standard Advanced Engineering

Min Outer 1/2 oz 3/8 oz 1/4 ozMin Inner 1/2 oz 3/8 ozMax Inner 1 oz 2 oz 3 & 4 ozMax Outer 2 oz 3 & 4 oz 5 oz

Isola 370 HRNelco 4000-29

N4000-13 EPN4000-13EP SI

PolyimideRogers 4000

18" x 24" 16" X 18" 24" x 36"21" x 26" 14" X 26" 26" x 30"24" x 26" 18" x 30"21" x 24" 24" x 30"

Materials

Panel Sizes

Copper Weights 3/8 oz

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ATE Design Guidelines

Standard Advanced Engineering

BC2000™ FaradFlex™Dupont HK04

Ceramic Filled

Electrolytic Gold, OSPLead Free HASL, ENIG

Immersion Silver, Immersion Tin

E-Less GoldENEPIGMultiple Finishes

+/- 0.0025" +/- 0.001"0.008" 0.005"

Via Fill/Cap PlateNon-CVF = Non-Conductive Via Fill 0.008" 0.006" 0.004"

CVF = Conductive Via Fill Non-CVF & CVF Non-CVF & CVF Non-CVF

Surface Finishes

Solder Mask ClearanceSolder Mask Opening

Embedded Passives

+/- 0.0020"0.006"

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ATE Design Guidelines

Standard Advanced Engineering0.007" 0.006" 0.005"

Min A/R Drill + 0.008" Drill + 0.006" Drill + 0.004"Tangency

Circuit to PCB edge 0.025" 0.010" 0.008”

Plane to PCB edge 0.025" 0.010" 0.008”

Routing Tolerance +/- 0.005" +/- 0.004" +/- 0.002”

Edge of hole barrel 0.025" 0.020" 0.016”to PCB Edge

Solder Mask Dam 0.004" min 0.003" min 0.0025” min

Drill-to-Copper

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ATE Design GuidelinesStandard Advanced Engineering

0.005”

Buried Mechanical Vias 0.005” 0.004”

Laser Drilled Microvias 0.006” 0.005” 0.004”

Mechanical Depth Drilled Vias 0.5:1 0.75:1 1:1

Back Drill Yes Yes Yes

Back Drill Depth Tolerance +/- 0.004" +/- 0.003" +/- 0.002"

Stacked Microvias 1+1 2+2 3+3 4+4

Copper Filled Microvias Yes Yes Yes

Conductive Via Fill Yes Yes YesNon Conductive Via Fill Yes Yes Yes

Impedance Control +/- 10% +/- 8% +/- 5%

Sequential Lamination Yes Yes Yes

Blind Mechanical Vias 0.004”0.006”

0.006”

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Micro section picture from 30 layer ATE PCB

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Micro section picture from 30 layer ATE PCB

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In Summary

• The ATE/BIB market segment has been on our radar for some time as it extends our level of support to our existing customerbase

• Recent activities have allowed us to support the high end of theATE technology spectrum

• Dual site approach minimizes the risk to customer and allows for site to site synergies

• The acquisition of key talent and specialized equipment set has enabled DDi to shorten the process development time to support the high end market

• DDi is committed to supporting a broad spectrum of PCB products used by a multitude of customers and this product set will expand our offering in both regards