abab dipamat direct patterning materials etch / plating resist

16
ab DiPamat Direct Patterning Materials Etch / Plating Resist

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Page 1: Abab DiPamat Direct Patterning Materials Etch / Plating Resist

ab

DiPamat

Direct Patterning Materials

Etch / Plating Resist

Page 2: Abab DiPamat Direct Patterning Materials Etch / Plating Resist

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abSlide 2

What is resist

A photo resist is a chemical product that, under the influence of UV light,

changes its chemical nature.

Resist without UV: is washed away during resist development

Resist with UV:

is NOT washed away during resist development protects the copper in the etch batch is stripped away after etching

Remark:

1 Etch resist: print & etch of inner layers

2 Plating resist: print, plate & etch of outer layers

Page 3: Abab DiPamat Direct Patterning Materials Etch / Plating Resist

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abSlide 3

What is resist

Liquid photo resist (20%)• Curtain, roller- or spray coated• Thickness: 5 - 20µm• Pro: high resolution• Contra: dust inclusions and chemical sensitivity

Dry photo resist (80%)• Cold, hot or wet laminated• Thickness: 25 - 75µm• Pro: high yield and good tenting• Contra: line width

Tenting: Via’s must be tented to avoid resist getting in the via

Page 4: Abab DiPamat Direct Patterning Materials Etch / Plating Resist

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abSlide 4

Traditional resist printing

Workflow:• Design• Image and develop film, check• Coat, laminate resist• Image resist• If laminated: peel cover layer• Develop resist• Etch• Strip

Working with resist is:• A time consuming process step• Expensive• Fixed data• Ecological unfriendly

Page 5: Abab DiPamat Direct Patterning Materials Etch / Plating Resist

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abSlide 5

Inkjet resist printing

Principle:• apply etch / plating resist• directly on the panel• using a set of Inkjet nozzles mounted on a XY table• ie without the use of a phototool or screen

Workflow:• Design• Print (with pin curing)• Curing (thermal and/or UV)• Etch• Strip

Page 6: Abab DiPamat Direct Patterning Materials Etch / Plating Resist

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abSlide 6

Inkjet resit printing

Advantages:• Reduce cost

- no phototool, less production steps- shorter production cycle, higher yields

• Registration panel per panel / distortion compensation- front-to-back- outer layer to inner layer

• Design changes & variable data per board• Fast (no set up)• Ecology

Page 7: Abab DiPamat Direct Patterning Materials Etch / Plating Resist

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abSlide 7

Quid May 2013

R&D project is in progress

Jetability and etch resistance: OK

Stripability: concepts are tested

Planning• One ER fieldtest in operation by end 2013• Proliferation of ER in 2014• Concept study PR

Page 8: Abab DiPamat Direct Patterning Materials Etch / Plating Resist

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abSlide 8

Quid May 2013

Page 9: Abab DiPamat Direct Patterning Materials Etch / Plating Resist

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abSlide 9

Quid May 2013

Page 10: Abab DiPamat Direct Patterning Materials Etch / Plating Resist

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abSlide 10

Quid May 2013

Page 11: Abab DiPamat Direct Patterning Materials Etch / Plating Resist

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abSlide 11

Competition: Dow (Rohm and Haas)www.dowelectronicmaterials.com

Phase shift ink

Page 12: Abab DiPamat Direct Patterning Materials Etch / Plating Resist

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abSlide 12

Competition: MacDermidwww.macdermid.com

Page 13: Abab DiPamat Direct Patterning Materials Etch / Plating Resist

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abSlide 13

Competition: MuTracx

Spin-off from OCE Technologies (Canon)

Announces Lunaris: print system and etch resist for IL

Phase shift inkl

Uses Predict

Fieldtest summer 2010 in EU

Commercially available by mid 2011

www.mutracx.com

Page 14: Abab DiPamat Direct Patterning Materials Etch / Plating Resist

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abSlide 14

Competition: MuTracx

Page 15: Abab DiPamat Direct Patterning Materials Etch / Plating Resist

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abSlide 15

System supplier: MuTracx

lunaris animation.avi

Page 16: Abab DiPamat Direct Patterning Materials Etch / Plating Resist

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abSlide 16

Conclusion

Inform your customers and prospects on our plans

Gather as much information as possible