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Impacto de una buena cobertura de pruebaTRANSCRIPT
IntroductionIntroduction
In-Circuit Test is Most Versatile Solution
• Missing
• Gross Shorts
• Gross Opens
• Polarity
�Electr ical�Electr ical
�AOI
ICT AXI • Most Versatile Solution• High Volume Global Mfg.• Limited Access Test• On-board Programming• Combo Test
ICT: In-circuit TestAXI: Automated X-ray InspectionAOI: Automated Optical Inspection
• Insufficient
• Poor wetting
• Marginal Joints
• Voids
• Excess
• Dead Part
• Wrong Part
• Bad Part
• PCB Short/Open
• Functionally Bad
• Inverted
• Polar ity
•Missing Socketed Parts
• Excess
•Bridging
• Tombstone
•Misalignment
•Orientation
• Missing Non-Elec.
• Bypass Caps, L’s
• Extra Parts
•Mark Inspection
• Shorts
• Opens
• Invisible parts
In-Circuit Tests in Electronics Manufactur ingIs it worth it ?
Creates key process improvements
With In-Circ uit te s t, y o u c a tc h p ro c e s s fa ults e a rly -whe n the y a re le a s t e x p e ns iv e to fix - a nd c o rre c t p ro c e s s d rifts tha t c a n re d uc e the q ua lity a nd re lia bility o f y o ur p ro duc ts in the fie ld .
At the tim e a bo a rd re a c he s the e nd o f the line , the re a re fe we r fa ults to d e te c t a t func tio na l te s t, a nd fe we r p o te ntia l q ua lity p ro ble m s a fte r y o ur p ro duc ts s hip . S
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ConfidencConfidenceeActionable Actionable Information Information
In-Circuit Tests in Electronics Manufactur ingIs it worth it ?Reduce Product Cost
With In-c irc uit te s t, p ro c e s s e s run m o re e ffic ie ntly , p ro duc ing c o s t s a v ing s tha t rip p le d o wn the line .
Fe we r bo a rd s to re p a ir, s o e x p e ns iv e re wo rk is re duc e d .
The bo ne p ile o f fa ile d bo a rd s is s m a lle r, s o s c ra p is m inim iz e d a nd m a te ria l c o s ts a re lo we r.
Thro ug hp ut a t func tio na l te s t is im p ro v e d , s o fe we r te s t s y s te m s c a n ha nd le hig he r v o lum e s , re duc ing c a p ita l c o s ts tha t d riv e up the p ric e o f bo a rd s .
In-Circuit Tests in Electronics Manufactur ingIs it worth it ?
..The Bottom Line
In-Circ uit m e a ns e ffic ie nt, c o s t-e ffe c tiv e m a nufa c turing , w ith q ua lity p ro duc ts a t the e nd o f the line .
The Real-Life Tester Process
ICT Functional
Repair Repair
Bone Pile
Assumptions
ICT Functional
Repair Repair
Bone Pile
Perfect! Perfect!
No boards
No boards
No boards
What If Test Coverage is 100%-Ideal-
ICT Functional
Repair Repair
Bone Pile
�625,000
�93,750
�2500 boards / day�250 days / year�85% Yield
�28,125
�531,250�+93,750 �625,000
�93,750
What If Test Coverage is 80%
ICT Functional
Repair Repair
Bone Pile
�625,000
�75,000
�2500 boards / day�250 days / year�85% Yield
�18,750
�18,750
�531,250�+75,000
�625,000
�75,000 18,750
�ICT measures manufacturing's 85% yield as 88%
�Functional measures ICT's yield as 97%
What If Test Coverage is 95%
ICT Functional
Repair Repair
Bone Pile
�625,000
�89,062
�2500 boards / day�250 days / year�85% Yield
�4,688
�4,688
�531,250�+89,062
�625,000
�89,062 �4,688
�ICT measures manufacturing's 85% yield as 85.75%
�Functional measures ICT's yield as 99.25%
Yield vs Test Coverage?
�2.25% difference in
yield }
400% difference in faults detected
�A few percentage points increase in in-circuit yield can mean the difference of thousands of bad boards passed on to functional repair.
�{
Cost of Poor Test Coverage?
ICT Functional
Repair Repair
Bone Pile
$1/R
epai
r $6/Repair
How Test Coverage Affects Cost
$0
$50,000
$100,000
$150,000
$200,000
ICT Repair FunctionalRepair
Total
80% Test Coverage 95% Test Coverage
� $70,310�}
Assumptions: Repair Cost at ICT Level: 1.00 USD Repair Cost at Functional Level: 6.00 USD
Additional Cost Savings
Lower Costs•Fewer Boards to repair at Functional Test.•WIP is reduced.•Bonepile of failed boards is smaller.•Scrap is minimized.•Fewer Functional Test Systems reducing capital costs.
Higher Quality •Fewer Potential quality problems at Assembly Plants
Thank you !